The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
UX60S Please ●  the productsstatus   theHirosewebsiteRoHSsearch meeting requirements of your 2.0 sales Standard
All non-RoHS products have been discontinued, or will be discontinued soon. Series check Mini-B Connectors, SMT mount receptacles www.hirose-connectors.com, or contact USB Hirose representative.
B Packaging Specifications
● Embossed carrier tape dimensions
12
Unreeling direction
4
2
?1
.5
● Reel Dimensions
(30.4)
(24.4)
Unreeling direction
B Recommended temperature profile
● Lead-free solder paste
Temperature:(?)
250
230
170±10?
80~110S
230? min.
MAX 50S
● HRS test condition
Solder composition : Paste Cu/ 96.5% Sn/3.0% Ag/0.5%
Test board : Glass epoxy 35mm ∞ 35mm ∞ 0.8mm thick
200
The temperature profile is based on the shown conditions. In
0
170
200? min.
MAX 80S
individual applications the temperature may vary, depending on
solder paste type, volume/thickness and board size/thickness.
Consult your solder paste and equipment manufacturer for
specific recommendations.
Time (Seconds)
Average slope
2? / sec.
7
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